Data Center

Multi-vendor Co-packaged Optics for AI Networks

Marvell, ‪Jabil, ‪Mikros Technologies and ‪SENKO Advanced Components squeeze a 102.4T switch into a 1OU tray with co-packaged optics, liquid cooling and advanced connectors for dense AI data centers at the 2025 OCP Global Summi...
Nov-18-2025

Active Electrical Copper (AEC) Cable Demonstration: Marvell and Foxconn (FIT) Collaboration

This first-time collaboration between Marvell and Foxconn Interconnect Technology (FIT) provides active electrical copper (AEC) cables to an ever-demanding market. A.J. Yang of Foxconn walks through the demonstration of the 1.6...
Nov-18-2025

The Copper Renaissance: Reimagining Copper for AI Data Centers

Copper is getting a major upgrade for the AI era. It's been a staple in the semiconductor industry, but for higher bandwidth needs, the distance shrinks, so copper needs the assistance of optics and innovative design. Co-packag...
Nov-18-2025

Expanding the Active Electrical Cable (AEC) Realm in the Connectivity Universe

One size does not fit all with active electrical cables (AECs). See how Marvell and its partners are seeding an ecosystem for interconnect innovation.
Nov-18-2025

Optical Connectivity Trends and the Impact of AI with Vlad Kozlov of LightCounting at ECOC

18 pluggable modules for a single GPU? And pluggables deployed for scale up? We caught up with Vlad Kozlov of LightCounting on the floor at ECOC to hear about the latest trends for scale-up, scale-out, scale across and the impa...
Oct-10-2025

Co-Packaged Optics (CPO) Demo Led by Chris McCormick at ECOC

When will CPO hit the inflection point? The consensus at the 2025 ECOC Exhibition is 2028 and possibly earlier, says Chris McCormick of Marvell Technology, who also shows off a design for XPUs powered by 6.4T light engines.
Oct-10-2025

Transmit-Retimed Optics (TRO) Save Power with Matt Sysak of Lumentum at ECOC

Transmit-retimed optical DSPs can cut module power by ~30-40% in specific use cases. Matt Sysak, CTO of Lumentum, explains how TRO is part of a broader trend to squeeze more megawatts out of accelerated infrastructure through o...
Oct-10-2025

Marvell is Transforming Custom Silicon

Custom silicon for data centers represents a $94 billion opportunity by 2028 and will impact compute processors, networking switches, interconnects, and storage. See how Marvell is accelerating the shift to custom with advances...
Aug-25-2025

Connectivity for the Million XPU Era

The global market for optical interconnect has doubled since 2020 to nearly $20B and is expected to double again by 2030, says Marvell SVP and GM of Connectivity Business Unit Xi Wang in his conversation with Will Townsend from...
Jul-18-2025

Customization of HBM and Switch Technology is Changing Data Center Infrastructure

Customizing high-bandwidth memory provides 17 times the bandwidth of off-the-shelf memory solutions, and customization has even moved into switching. In a conversation with Will Townsend from SixFive Media, Rishi Chugh and Mark...
Jul-14-2025