Data Center

Marvell is Transforming Custom Silicon

Custom silicon for data centers represents a $94 billion opportunity by 2028 and will impact compute processors, networking switches, interconnects, and storage. See how Marvell is accelerating the shift to custom with advances...
Aug-25-2025

Connectivity for the Million XPU Era

The global market for optical interconnect has doubled since 2020 to nearly $20B and is expected to double again by 2030, says Marvell SVP and GM of Connectivity Business Unit Xi Wang in his conversation with Will Townsend from...
Jul-18-2025

Customization of HBM and Switch Technology is Changing Data Center Infrastructure

Customizing high-bandwidth memory provides 17 times the bandwidth of off-the-shelf memory solutions, and customization has even moved into switching. In a conversation with Will Townsend from SixFive Media, Rishi Chugh and Mark...
Jul-14-2025

The Rise of Custom and How It’s Different Than the ASIC Business Model

Moore’s Law is slowing, but data centers don’t care, says Mark Kuemerle of Marvell. His colleague Rishi Chugh points out that 25% of compute silicon will be custom inside data centers. Will Townsend from SixFive Media moderates...
Jul-14-2025

Chiplets and Custom

With designs including more than 2,000 square millimeters of silicon needing to be integrated together, the only way to achieve the required performance is to break it into pieces. Chiplets do that and are a driving force in th...
Jul-14-2025

What’s Next for Custom

In a chat with Will Townsend from SixFive Media, Rishi Chugh and Mark Kuemerle from Marvell talk about how data center customization is expanding beyond compute to connectivity and switch products.
Jul-14-2025

Building Data Centers to Scale | Chris Koopmans

Marvell COO Chris Koopmans shares with Daniel Newman from The Futurum Group how hyperscalers are looking beyond custom XPUs to customizing entire platforms with advanced packaging, scale-up fabrics, high-speed copper, co-packag...
Jul-10-2025

Addressing the ‘Power Problem’ of Huge Data Centers | Chris Koopmans

How much performance do you need and what power will you need to achieve it? Those are the most important questions in computing, according to Marvell COO Chris Koopmans in his conversation with The Futurum Group CEO Daniel New...
Jul-10-2025

Co-Packaged Copper: A New Technology for Interconnects

As data centers are tasked with moving more data (from 50G/lane to 200G/lane), it's harder to push electrical signals out the same distances. Enter co-packaged copper, with the signal coming directly off the top of the package....
May-28-2025

Co-Packaged Optics Through Silicon Photonics

Kishore Atreya, Senior Director of Cloud Platform Marketing at Marvell, discusses co-packaged optics at OFC 2025. He explains that co-packaged optics involves integrating optical components directly with silicon chips on the sa...
May-21-2025