Test Drive: Dell, Marvell and Cisco Ace the SAN Stress Test

May-20-2026

Subbu Seshadri demonstrates Marvell’s new Atlas PAM4 DSP, the industry’s first chipset in bare die form w...

Atlas PAM4 DSP Demo

May-20-2026

Keysight Technologies puts the Marvell PCIe 7.0 SerDes through a battery of harsh tests to see if it can ...

The PCIe 7.0 Stress Test at DesignCon 2025

May-15-2026

Michael Kanellos of Marvell showcases some of the ways TeraHop is using Marvell technology in their modul...

TeraHop and Marvell Demos at OFC 2025

May-15-2026

Matthew Sysak, CTO of Cloud and Networking at Lumentum, walks through the demo of the industry's first 45...

Lumentum and Marvell Showcase Industry's First 450G Demo at OFC 2025

Apr-07-2026

Extending in‑rack copper reach is critical for scaling AI data center infrastructure—without increasing c...

Extending In‑rack Copper for AI: A Hybrid 200G ACC/AEC Solution

Apr-06-2026

The rapid growth of generative AI is reshaping data center architecture. As infrastructure evolves from i...

Scaling AI Data Centers with 1.6T & 800G Coherent Pluggable Optics

Apr-06-2026

As AI clusters scale, even a single unstable connection can slow inference or disrupt training. That’s wh...

Keeping AI Clusters Fast & Reliable with Real‑Time Interconnect Telemetry

Feb-12-2026

Teralynx 102T is the industry’s first and only monolithic die, continuing the Marvell legacy—and Teralynx...

Introducing Teralynx 102T: Industry’s Only Monolithic Die

Nov-18-2025

This first-time collaboration between Marvell and Foxconn Interconnect Technology (FIT) provides active e...

Active Electrical Copper (AEC) Cable Demonstration: Marvell and Foxconn (FIT) Collaboration

Nov-18-2025

Copper is getting a major upgrade for the AI era. It's been a staple in the semiconductor industry, but f...

The Copper Renaissance: Reimagining Copper for AI Data Centers

Nov-18-2025

One size does not fit all with active electrical cables (AECs). See how Marvell and its partners are seed...

Expanding the Active Electrical Cable (AEC) Realm in the Connectivity Universe

Nov-18-2025

Marvell, ‪Jabil, ‪Mikros Technologies and ‪SENKO Advanced Components squeeze a 102.4T switch into a 1OU t...

Multi-vendor Co-packaged Optics for AI Networks

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