Marvell at DesignCon 2026

Marvell had a strong presence at DesignCon 2026. Across the conference, Marvell experts shared insights on high‑speed interconnects, advanced packaging, photonic links, bi‑directional die‑to‑die interfaces and next‑generation switch architectures. At the Marvell booth, teams demonstrated key technologies spanning SerDes, active copper and electrical cables, and high‑bandwidth die‑to‑die connectivity. It was a great opportunity to meet engineers, connect with ecosystem partners and highlight the innovations that will shape future AI infrastructure.