Inside the 1.6T DR8 PIC: Rack‑to‑Rack Silicon Photonics for AI Clusters
For rack‑to‑rack data center connectivity in AI clusters, the OpenLight 1.6T DR8 PIC (8 lanes × 200G = 1.6 Tbps) is a highly integrated silicon photonics engine designed for data‑center‑reach optical interconnects. This photonic integrated circuit sits inside optical modules or CPO systems to deliver high‑bandwidth optical links across racks.
The PIC works seamlessly with the Marvell Ara 3nm DSP, which conditions and processes the electrical signal before the PIC converts it into light. Together, they deliver excellent power efficiency—combining the low‑power benefits of integrated silicon photonics with the performance of a 3nm‑optimized DSP.
This architecture also enables straightforward scalability, supporting 1.6T today and extending to 3.2T and beyond. The PIC is the core element that generates and modulates the optical signal, enabling the high‑speed optical links required in modern AI data center networks.
