Powering AI with 224G LR SerDes and Co-Packaged Copper
For next‑generation high‑bandwidth data centers scaling toward 1.6 Tbps, 200G/lane I/O architectures, and high‑density switching for AI/ML training clusters, this 224G SerDes is optimized for co‑packaged copper (CPC) inside nex...
May-11-2026