George Hervey: Co-Packaged Optics vs. Co-Packaged Copper

George Hervey, Principal Architect from Marvell explains:
- New co-package copper design moves high-speed escape to substrate top via flyover wires, extending passive copper life within racks
- 224G-ready liquid cooling solution enables efficient rack-scale deployment in 1U form factor
- Co-package optics technology allows scaling to 1000-2000 node clusters with single-layer switching across multiple racks