Co-Packaged Optics Through Silicon Photonics

Kishore Atreya, Senior Director of Cloud Platform Marketing at Marvell, discusses co-packaged optics at OFC 2025. He explains that co-packaged optics involves integrating optical components directly with silicon chips on the same package substrate, enabling the conversion of electrical signals to optical ones using light engines. This integration reduces power consumption and signal loss, requiring only power from the PCB. The technology is versatile, supporting various applications and configurations, including both on-package and on-board implementations. Although still maturing, Marvell is actively developing and sampling this technology, aiming for long-term deployment and industry adoption.