
Will Chu: Innovating AI Data Centers with Custom HBM Architecture
Will Chu, SVP and GM of Custom Compute and Storage BU, highlights Marvell's leadership in customizing accelerated infrastructure for next-generation AI data centers. He discusses the advancements in customizing NICs, CPUs, and XPUs, and introduces the next step: customizing HBMs (High Bandwidth Memory). Will explains how custom HBMs will enable lower power consumption, better performance, increased memory capacity, and improved TCO (Total Cost of Ownership) for customers.
He also announces a new partnership with major HBM providers, including Micron, Samsung, and SK Hynix, to deliver innovative custom HBM solutions. These advancements promise significant power savings, increased die area for XPUs, and enhanced memory capacity, driving better overall value for customers.
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