Tune into the latest
Marvell Essential Technology Podcast
With the explosion of AI it’s time to rethink data center switching. Hear more from Nick Kucharewski, SVP and GM, Network Switching at Marvell.
Co-Packaged Copper: A New Technology for Interconnects
Co-Packaged Optics Through Silicon Photonics
PCIe + AEC and Optical : A new Era for Connectivity
Dropping Optical Power for AI: Marvell and Coherent Collaboration
George Hervey: Co-Packaged Optics vs. Co-Packaged Copper
The Value of Custom Silicon in the AI Era
Loi Nguyen : Powering Gigawatt-Class Data Centers with Advanced Optics
Will Chu: Innovating AI Data Centers with Custom HBM Architecture
Achyut Shah: Introducing Coherent Light for Intermediate Data Center Connectivity
Achyut Shah: Advancing PAM Technology for High-Speed Data Centers
Chris Koopmans: Expanding AI Infrastructure with Custom Silicon and Connectivity
Raghib Hussain: Building Optimized AI Infrastructure with Custom Silicon